Diamond Lapping Paste, Slurries and Compound
DIANAMIC ® offers Diamond Compound, Diamond Slurries and Lapping Paste manufactured in North America to the most exacting standards. Specific grades of Micronized Virgin Diamond have been tested and chosen for their exceptional quality, durability and performance under all polishing and lapping conditions.
Each batch of micronized Diamond is tested and certified with a Grade Quality Certification using a proprietary Particle Analysis System that combines statistical and video analysis for exact evaluation. Test results by Lot Number are available on request to support your quality control measures such as ISO documentation requirements.
M-based compounds offer a wide thermal processing range of up to 400F° that allows this M-based compound to be used under the most demanding applications.
Applications and suggested uses are for ‘M’ base compound are for precision finishing of all types of dies and molds and polishing optical, ceramic and electronic components.
U-based compounds are less viscous than ‘M’ based compound. This compound offers better flow-ability and is better suited for lapping and high speed applications.
Applications and suggested uses for ‘U’ base compound are for precision finishing of all types of dies and molds and polishing optical, ceramic and electronic components.
W-based compounds (water soluble) offer specific characteristics ideally suited for the preparation of tools and dies that will be subsequently electroplated or chemically or physically coated. No thinner or solvents are required with ‘W’ based compound. There is no impregnation by the compound in the substrate prior to coating.
Applications and suggested uses are the polishing of tools and ides prior to CVD and PVD coatings. This compound is also suited when environmental issues are important.
Compounds, Paste and Slurries are available in extra light, light, medium, heavy, extra heavy and super heavy concentrations. The concentrations by carat weight are the highest available on the market. Specific carat weight concentrations are available by special order.
Specially formulated concentrations are available for your special requirements:
- Production lapping machines used to radius carbide inserts.
- Edge preparation where very small radii are required with limited stock removal.
- Ring gears for final fit prior to assembly in transmissions.
- Water Based Media where environmental concerns prevent the use of oil based products.
Compound thinner specifically designed and manufactured for thinning ‘M’ and ‘U’ based compounds is available. The thinner is non-toxic and non-hazardous and offers an excellent method to spread the diamond media evenly while keeping it moist and offering efficient clean up. This thinner works well with other manufacturers’ media.
Compound and Lapping Paste is available in standard 5 gram and 18 gram tubes or jars. Larger containers and dispensers are available upon request, such as 454-gram tubs (1 pound).
Thinner is available in 200cc, 500cc or 4 liter bottles.
Slurries is available in 500 gram, 1000 gram and 5000 gram containers.
Standard Grade Micron Sizes Available
PASTE AND COMPOUND
|AVAILABLE IN JAR,
SYRINGE OR TUB
|.5||0-1 MICRON||LIGHT GRAY|
|0 – .5||0-.5 MICRON||GRAY|
|0 – .1||0-.2 MICRON||WHITE|
From standard coatings to special applications, DIANAMIC® will meet all your special Diamond and cBN requirements. Our sales and engineering staff work closely with our customers to develop optimized solutions for grinding problems.